Loongson Technology announced a private placement of up to RMB 2.3 billion ($317M) , issuing up to 40.1 million A‑shares ( <10% of pre‑issue capital). Proceeds (after expenses) will be allocated: RMB 971M for Xnm‑based information chip R&D and industrialization, RMB 485M for Xnm CPU core technology R&D, RMB 360M for Xnm general‑purpose GPU core technology R&D, and RMB 483M for working capital. The plan requires shareholder, SSE review, and CSRC registration.

On the product front, Loongson 3A6000 desktop CPU has exceeded 1 million shipments in mainstream markets – a milestone for domestic CPU performance, ecosystem, and commercialization.

ICgoodFind: Loongson’s large‑scale funding for advanced process R&D and its million‑unit CPU shipments signal strong momentum for China’s self‑developed silicon.